The MICROTEST TTV-12000 Series High Power Density Thermal Test Vehicle System is specifically designed to meet the thermal testing requirements of AI servers and high-performance computing (HPC) chips. Each heater supports a maximum rated power of up to 12,000 W, with a maximum heat flux of 1,000 W/cm² per zone.

The system simulates the thermal load conditions of high-power chips during operation, enabling R&D teams to validate the performance of liquid cooling systems, cold plate designs, and thermal interface materials (TIM). It also facilitates the evaluation of heat transfer and thermal dissipation performance under various power conditions, supporting the development and design optimization of thermal management technologies for high-power AI servers.

The TV-12000 System features a high-power, low-voltage design, delivering up to 12,000 W per heater with a power ramp rate of 2,000 W/s. It supports a 24-zone heating configuration and 24-channel PWM power control, allowing flexible adjustment of thermal load distribution to meet diverse testing requirements. Seven temperature monitoring points provide real-time monitoring of thermal variations, while dedicated interlock protection and insulation relays enhance operational safety. These features ensure precise control, system stability, and safe operation during high-power thermal testing.